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Gigabyte

Gigabyte B550M DS3H AC R2 Wifi AM4 mATX motherboard

Gigabyte B550M DS3H AC R2 Wifi AM4 mATX motherboard

Regular price $159.00
Regular price Sale price $159.00
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Gigabyte B550M DS3H AC R2 Motherboard

The Gigabyte B550M DS3H AC is a high-value Micro-ATX motherboard designed to maximize the performance of AMD Ryzen™ 5000 Series, 5000 G-Series, 4000 G-Series, and 3000 Series processors. Built on the B550 chipset, it offers a perfect balance of essential features and future-proof connectivity, including PCIe 4.0 support and integrated Dual Band Wi-Fi.


Key Features & Specifications

  • Socket & Chipset: AMD Socket AM4 for Ryzen™ Processors; B550 Chipset.

  • Memory Support: 4x DDR4 DIMM slots supporting up to 128GB of system memory; Dual Channel architecture with support for ECC/Non-ECC Unbuffered modules.

  • High-Speed Connectivity:

    • PCIe 4.0 x16 Slot: Ready for high-performance graphics cards.

    • Dual M.2 Slots: Features a PCIe 4.0 x4 M.2 slot for ultra-fast NVMe SSDs.

  • Networking:

    • Onboard Dual Band 802.11ac Wi-Fi & Bluetooth support.

    • Realtek® GbE LAN with bandwidth management for lag-free gaming.

  • Advanced Cooling: Smart Fan 5 technology featuring multiple temperature sensors and hybrid fan headers with FAN STOP functionality.

  • Audio: High-quality audio capacitors and an audio noise guard for immersive sound.

  • RGB Fusion 2.0: Support for addressable LED and RGB LED strips for full system lighting customization.

 

Technical Specifications:

  • AMD Socket AM4:Supports AMD Ryzen™ 5000 / 4000 / 3000 Series Processors
  • Digital 5+3 phases VRM solution
  • Dual Channel DDR4:4*DIMMs
  • WIFI EZ-Plug:Quick and easy design for Wi-Fi antenna installation
  • EZ-Latch:PCIe slots with Quick Release Design
  • Ultra-Fast Storage:2*M.2 slots, including PCIe 4.0 x1
  • Efficient Thermal:VRM Thermal Armor Advanced
  • Fast Networking:GbE LAN & Wi-Fi 5
  • Extended Connectivity:HDMI, Displayport
  • PCIe UD Slot:PCIe 4.0 x16 slots with 10X strength for graphics card & Better Heat dissipation effect
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